IBM announced significant advances in its path to integrate electrical and optical devices on the same piece of silicon. The new CMOS Integrated Silicon Nanophotonics, which is the result of a decade of development at IBM's global Research laboratories, promises over 10 times improvement in integration density than is feasible with current manufacturing techniques.
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"The development of the Silicon Nanophotonics technology brings the vision of on-chip optical interconnections much closer to reality,” said vice president, Science and Technology, IBM Research. “With optical communications embedded into the processor chips, the prospect of building power-efficient computer systems with performance at the Exaflop level is one step closer to reality."
This CMOS Integrated Nanophotonics breakthrough preedicts unprecedented increases in silicon chip function and performance via ubiquitous low-power optical communications between racks, modules, chips or even within a single chip itself. The next step in this advancement is to establishing manufacturability of this process in a commercial foundry using IBM deeply scaled CMOS processes.
IBM has been pursuing an ambitious Exascale computing program, which is aimed at developing a supercomputer that can perform one million trillion calculations—or an Exaflop in a single second.
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